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January 2010
Superior Processing Launches
New Website
March 2010
Superior Processing implements silver and tin/gold alloy plating for special soldering applications
June 2010
Implemented palladium plating to provide more options for our customers
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This is a brief description of our Nickel plating process:
- Our low stress nickel is a sulfamate based bath. It is used as a diffusion barrier for copper migration and excellent solderability. Our nickel meets the requirements of QQN-290 and ASTM 2424.
- Thickness deposits are typically 100-250 uin when used as an under-plate for gold. The deposit is semi-bright.
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