Our chemical controls are maintained and monitored and uses true chemical analysis software.

Low Stress Nickel Plating
We control our Nickel baths to produce uniform, low stress, semi-bright deposits on Copper that meet the common industry specifications such as AMS QQN-290, AMS 2423, AMS 2424. The baths are tested regularly to ensure the proper hardness and stress properties with consistent coating thickness on surfaces and in holes.


Hard Gold & Soft Gold
Both our Hard and Soft Gold plating baths plated produce uniform, semi-bright deposits that meet the common industry specifications such as ASTM B-488, and DTL-MIL 45602. The baths are tested regularly and maintained within the specified limits for Solderability, Wire bond-ability, Hardness, and Purity. Our Nickel and Hard Gold tanks can handle panel sizes up to 33” x 24”. Our Soft Gold tanks 21” x 36”. We can process either selective plate or tie bar methods for contact.

Hard Gold meets the purity requirements of Type 1 (99.7% minimum) and Type 2 (99 % minimum) with hardness Code C (130-200 knoop). This provides a homogenous, solderable, contact resistant coating.

Soft Gold meets the purity requirements of Type 3 (99.9% minimum) and hardness Code A (90 knoop maximum). This provides and excellent Gold wire bondable surface.


Electro-less Nickel and Immersion Gold (ENIG)

This is a multifunctional surface finish applicable to Soldering, Aluminum wire bonding, press fit connections and as a contact surface. We have mid Phosphorous electroless Nickel baths the use mid-depth Immersion Gold. This coating meets various ENIG plating specifications including IPC 4552. The baths are tested continuously using automated controllers. We can handle standard panel size’s up to 21” x 24”.


Electro-less Nickel, Electro-less Palladium and Immersion Gold (ENEPIG)

This is a multifunctional surface finish applicable to soldering, Gold wire bonding, and as a contact surface. This coating also uses a mid Phosphorous electroless Nickel followed by either pure Palladium or Palladium containing Phosphorous. This coating meets various industry ENIG plating specifications including IPC 4556. We can handle standard panel size’s up to 21” x 24”.


Electro-less Palladium and Semi Autocatalytic Immersion Gold (EPIG)

This coating allows for an electroless deposit of phosphorous enriched palladium directly on copper followed by a solderable and gold were bondable semi-autocatalytic gold. Typical plating thickness deposits are 4-20 Palladium followed by 5-12 Gold. Panel sizes are limited to 18″ x 24″ in size.


Electro-less Nickel, Electro-less Gold (ENEG)

This coating process allows for thicker electroless Gold deposits to be applied to either ENIG or ENEPIG designs. We can safely build up wire bondable Gold to thickness’s up to 50 uin. Panel size’s are limited to 18” x 24” in size.


Immersion Silver (Sterling)

This is a multifunctional surface finish applicable to soldering, press fit connections and as a contact surface and can be used for Aluminum wire bonding. This coating meets various industry ENIG plating specifications including IPC 4553. We can handle standard panel size’s up to 21” x 24”.


Immersion Tin (White Tin)

This is a surface finish applicable to soldering, press fit connections and as an interface for ZIF edge connectors. This coating meets various industry ENIG plating specifications including IPC 4554. We can handle standard panel size’s up to 21” x 24”.


Coating Thickness Verifications

Thickness is determined using state of the art X-Ray Spectrophotometers. The XRF equipment is calibrated and gage tested regularly to ensure accurate thickness measurements. The XRF detectors are both solid state “Silicone Drift” and “Proportional Counter” technology capable of reading multilayer and tri-layer metal thicknesses.