Electrolytic Nickel, Gold

IPC Codes: G, GS, GWB-1, GWB-2, N, NB (Depending on application).

Depending on applications, printed circuit board technologies use gold extensively. Gold has good electrical conductivity, tarnish resistance, solderability after storage, and being excellent etch resist.  Electrolytic Ni/Au has a layer of gold plating over a base of electroplated nickel.  Hard or Soft Gold can be used with each option.

Hard gold is a gold alloy with complexes of cobalt and/or nickel. is typically used for minimum contact resistance, connector tabs.  Hard gold is not suitable for wire bonding.

• Complies with
  • MIL-DTL-45204 Type I and II, Grade C
  • ASTM B 488, Types I and II, Code C
• Hardness range of 130-200 Knoop.
• The Gold purity is a minimum of 99.70%.

Soft gold finish is typically used for boards designed mostly for applications that require wire bonding, high solderability and weldability.

• Complies with
  • MIL-DTL-45204, Type III, Grade A
  • ASTM B 488, Types III, Code A
• Hardness maximum of 90 Knoop.
• The Gold purity is a minimum of 99.90%.

Nickel is a low stress, semi-bright, ductile deposit.

• Complies with
  • SAE AMS-QQ-N-290 Class 1 and 2
  • SAE AMS2423
  • SAE AMS2403
  • ASTM B689-97
  • SAE AMS2424 (Special Request Required)

IPC-6011 gives a guideline for the thickness requirements for each layer being per the table below but for some applications different thickness are specified by our customer.